Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:May 06, 2026～Jun 02, 2026
This ranking is based on the number of page views on our site.
1～30 item / All 98 items
It is an all-in-one selective flow system for small-batch production that performs "prefluxing," "preheating," and "soldering" all in one machine.
You can choose from inline type or cell production type based on production processes, introduction costs, space, etc. All models are equipped with a dot fraxer, solder feeding feeder, and monitoring camera.
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
The vacuum soldering device removes voids in the solder by melting the solder in a vacuum. By performing preheating in a hydrogen atmosphere or formic acid atmosphere, it achieves flux-free soldering. It boasts the number one domestic track record as a standard machine in the power device manufacturing process. With the adoption of an upper lamp heater specification, it can accommodate large products and irregular substrates, including heavy items. [Exhibition Information] We will exhibit at Internepcon 2023. A panel of this device and samples of large products will be displayed. (Exhibition dates: January 25 (Wed) to January 27 (Fri) at Tokyo Big Sight, Booth Number: East Hall 1, 2-34) *For detailed specifications, please download the PDF. Feel free to contact us.
Accurate temperature control is possible! A local jet soldering device with excellent operability and safety.
The "Point Solder" is a device for locally soldering the leads of DIP components and others. By adopting a CPU digital system, it enables precise temperature control. It features a nozzle lever lock mechanism, making nozzle replacement easy and safe. The operation combines usability and safety, allowing for customizable jet flow times with a jet flow timer. 【Features】 ■ Significant reduction in work time due to standby function ■ Free power supply of AC100, 115, 230V (terminal block switching) ■ Solder tank/heater made of corrosion-resistant SUS316 ■ Equipped with a large front fender to prevent solder splatter ■ Designed with a solder tank unit system for interchangeability and maintainability *For more details, please download the catalog or contact us.
All stages operate simultaneously! To prevent temperature drop, we will wait in front of the preheating zone!
We would like to introduce our "Inline Selective" product. By using barcode and two-dimensional code management, or automatic stage change through substrate layout image recognition, along with the same frame jig for transportation, mixed production of a wide variety of small lots is possible. We offer a lineup that includes the one-frame types "EQS-350SDDD" and "EQSS-350SD+M," as well as the modular type "SELBO II." 【Features】 ■ Mixed production for small lots and a wide variety ■ All stages operate simultaneously ■ Tact balance can be set ■ To prevent temperature drop, it waits before the preheating zone *For more details, please refer to the PDF document or feel free to contact us.
With the all-in-one CCD camera (OP) teaching, it is easy to create soldering programs even for large substrates!
The "ULTIMA-NEO-L" is a standalone device that performs both flux application and soldering in one unit. With reliable solder contact to leads and patterns through point jet flow and optimal soldering conditions for each component, it achieves stable quality (such as T/H up). By upgrading from the standard 16kg solder capacity tank to the optional 32kg tank, a wider area corner nozzle can be used, allowing for reduced cycle times through extensive soldering, enabling nozzle selection according to application needs. 【Features】 ■ Long-selling device compatible with L-size PCBs ■ Standalone device that performs both flux application and soldering in one unit ■ Equipped with a touch panel and PC for easy and clear operation ■ By using the optional teaching function, all processes from scanning PCB data to creating flux application and soldering data can be completed within the device *For more details, please refer to the PDF document or feel free to contact us.
![[July 10th - 11th] Notice of Participation in the "Implementation and Assembly Process Technology Exhibition"](https://image.mono.ipros.com/public/product/image/2f5/2000852576/IPROS74182593440765993185.png?w=280&h=280)
Specialized in post-process automation! Introducing new equipment aimed at labor-saving for major domestic equipment manufacturers.
We will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2024" held at the Nagoya City Small and Medium Enterprise Promotion Hall. This exhibition specializes in post-process automation and will showcase new equipment aimed at labor-saving solutions from major domestic equipment manufacturers. We sincerely look forward to your visit. 【Event Overview (Excerpt)】 ■ Dates: July 10 (Wednesday) - July 11 (Thursday), 2024 ■ Hours: 10:00 AM - 5:00 PM *Last admission at 4:00 PM ■ Admission Fee: Free - General visitors: No registration required for factory representatives from manufacturing industries or equipment/product users (please submit 2 business cards at the reception) - Trading companies: Pre-registration is required *For more details, please refer to the PDF document or feel free to contact us.
Production management (traceability) supports quality control! Introducing our soldering equipment.
The EQSS-350SD is a space-saving inline model point soldering device. By adding an expansion unit to the "solder pot module," production efficiency is improved. The adoption of a two-dimensional code enhances the automatic changeover system and mixed production capabilities, improving production operating rates. 【Features】 ■ By setting the maximum substrate size of 350mm horizontally, the length of the spray and preheating dip device is reduced to 1600mm (excluding the feeder conveyor) for space-saving. ■ The addition of an expansion unit to the "solder pot module" improves production efficiency. ■ The use of a two-dimensional code enhances the automatic changeover system and mixed production capabilities, improving production operating rates. ■ Production management (traceability) supports quality control. *For more details, please refer to the PDF materials or feel free to contact us.
The dome cover is removable! It reduces solder droplet generation and suppresses solder hole formation with its jet mechanism.
The "GFL-350N" is a lead-free nitrogen soldering device with an open dome structure that does not have a curtain, accommodating component heights of up to 100mm. It supports model switching and traceability through two-dimensional codes and other means. The nitrogen dome is equipped with a mist collection and clean substrate cooling mechanism. 【Features】 ■ Open dome structure without a curtain, accommodating component heights of up to 100mm ■ Stable low oxygen concentration with a dome internal pressure adjustment structure at the entrance and exit ■ Jet flow mechanism that reduces solder dross generation and suppresses solder hole occurrence ■ The warpage prevention unit for the solder bath section operates externally without opening the dome (optional) *For more details, please refer to the PDF document or feel free to contact us.
Improving productivity of pallet dips! Enhancing through-hole ups of "low Ag solder."
The "SOFR-400" is an overflow-type automatic soldering machine that allows for the selection of four DIP methods. The production method can be chosen between inline compatibility and cell production compatibility (return back). In the peel-back DIP method, four electric cylinders are used, allowing for peel-back at angles of up to 4 degrees. 【Features】 ■ Four DIP methods can be selected ■ N2 supply is conducted simultaneously from four locations: the substrate transport section and the side of the solder tank, creating an N2 curtain that covers the solder surface ■ The production method can be chosen between inline compatibility and cell production compatibility (return back) ■ Compact design achieves space-saving *For more details, please refer to the PDF materials or feel free to contact us.
Not just a showroom, but launching an "experimental lab"! Seven manufacturers are exhibiting.
The collaborative project "MUSUBI," which hosts the Implementation and Assembly Process Technology Exhibition, has established an "experimental lab" in the Kansai region, not just a showroom, with seven equipment manufacturers. We invite you to bring your circuit boards to the lab and conduct verifications and experiments using the manufacturers' products. 【Hiroki Tech Showroom Equipment】 ■ Desktop Point Jet Soldering Device ■ Desktop Point Flux Application Device ■ All-in-One Point Jet Soldering Device *For more details, please refer to the PDF materials or feel free to contact us.
Exhibiting new equipment at Tokyo Big Sight! A reflow oven that significantly extends the frequency of in-furnace cleaning and a selective soldering machine with new features, among others.
Koki Tech Co., Ltd. will be exhibiting at the "38th Internepcon Japan Electronics Manufacturing and Packaging Exhibition" held at Tokyo Big Sight. The exhibition will take place over three days from January 24 (Wednesday) to January 26 (Friday), 2024, and our booth will be located at "East 1E4-48." We will showcase equipment such as the far-infrared combined hot air circulation reflow oven "VFR-408N" and the inline selective soldering machine "SELBOIII." 【Event Overview】 ■ Date: January 24 (Wednesday) to January 26 (Friday), 2024 ■ Venue: Tokyo Big Sight ■ Booth Number: East 1E4-48 *For more details, please refer to the PDF document or feel free to contact us.
Achieve labor-saving and automation with inline systems! Layout changes are possible with a modular configuration.
The "SELBOIII Series" is an inline selective soldering device that can add modules according to production volume. It improves soldering quality and reduces solder defects. Additionally, the optional substrate warpage correction function prevents nozzle contact. It also features various functions such as an air jet nozzle and a selective soldering bath. 【Features】 ■Improves soldering quality and reduces solder defects ■Supports labor-saving and automation in an inline format ■Can add modules according to production volume ■Layout changes possible with modular configuration ■Non-stop maintenance system (optional) *For more details, please refer to the PDF document or feel free to contact us.
We plan to exhibit a total of six devices, including selective soldering equipment and a doctor palette!
Koki Tech Co., Ltd. will be exhibiting at the "39th NEPCON Japan Electronics Development and Manufacturing Expo" held at Tokyo Big Sight. We plan to showcase a total of six pieces of equipment, including the "VFR-408N," which reduces flux cleaning, and the innovatively designed "ULTIMA-TRZ." We look forward to your visit. 【Exhibition Overview】 ■ Exhibition: 39th NEPCON Japan Electronics Development and Manufacturing Expo ■ Date: January 22 (Wed) - 24 (Fri), 2025, 10:00 - 17:00 ■ Location: Tokyo Big Sight, East Hall 1 ■ Booth Number: East 1E4-2 ■ Admission Fee: Free (Pre-registration required) *For more details, please download the PDF or feel free to contact us.
The pursuit of customer satisfaction leads to new technological innovations! Hiroki Tech products are born from a accumulation of cutting-edge technology.
This catalog introduces the products handled by Koki Tech Co., Ltd. It features various products such as "SpROBO," which applies flux efficiently under optimal conditions, and "NEO-L," which integrates a spray fluxer and solder pot into one unit. Details about each product's specifications and features are included, so please make use of this information when selecting products. [Contents] ■ Selective Soldering Series (Desktop/All-in-One) ■ Selective Soldering Series (Inline) ■ Wave Soldering Series ■ Far Infrared Combined Hot Air Circulation Reflow Oven VFR Series ■ Other Lineup ■ Peripheral Equipment *For more details, please download the PDF or feel free to contact us.
Area productivity increased by 15%! Maintaining substrate compatibility with a maximum size of 380×460 allows for diverse production.
The "ULTIMA-NEO-L Smart" is a selective soldering device that has achieved miniaturization compared to the conventional model NEO-L. The reduction in size has led to a 10% decrease in power consumption. The spray and solder pot have been consolidated into one unit, improving convenience. Additionally, easy data creation is possible (anyone can do it). It can be equipped with the new feature "Preheating Unit IPH" (optional). 【Specifications (excerpt)】 ■ Device dimensions: 1150(L)×1250(W)×1050(H)mm ■ Board size: 50(W)×50(L) to 380(W)×460(L)mm ■ Maximum board weight: 2kg ■ Component height: Upper 50mm, Lower 25mm (or less) ■ Air supply volume: 0.4-0.5MPa 50L/min *For more details, please download the PDF or feel free to contact us.
The substrate size is X50×Y50mm (MIN), X330×Y250mm (MAX)! Introducing our soldering series.
We would like to introduce our tabletop selective soldering series, 'ULTIMA-TRZII/SPZII'. The board thickness ranges from 0.8 to 2.0 mm, and the nozzle is a two-fluid nozzle with an inner diameter of φ2 to 20 mm (standard specification) / air jet (optional). Please feel free to contact us when you need assistance. 【Specifications of ULTIMA-TRZII (excerpt)】 ■ Equipment dimensions: W620×D940×H442(mm) [for reference] ■ Power supply: Single-phase AC200V±5% 4kVA ■ Equipment weight: Approximately 120kg [for reference] ■ Notes: Nitrogen supply rate (reference value) 25L/min (0.4 to 0.5MPa) *For more details, please download the PDF or feel free to contact us.
Held from June 4 (Wednesday) to June 6 (Friday), 2025! We plan to showcase new products at the exhibition venue.
Koki Tech Co., Ltd. will be exhibiting at the 'JISSO PROTEC 2025 (26th Assembly Process Technology Exhibition)' held at Tokyo Big Sight. This exhibition is a comprehensive showcase of electronic component assembly technology. Advanced technologies related to electronic component assembly, which are essential for the electronics society, will be gathered in one place. We plan to showcase our all-in-one selective soldering machine model "NEO-L Smart (with IPH)" among others. We understand you are busy, but we kindly ask for your visit. 【Exhibited Equipment】 ■ All-in-one selective soldering machine model "NEO-L Smart (with IPH)" ■ Infrared and hot air circulation reflow oven "VFR-408N" ■ Desktop selective soldering machine "ULTIMA-TRZ" ■ Desktop selective spray machine "ULTIMA-SPZ" ■ Doctor Palette ■ Inline selective soldering machine "SELBO III" *For more details, please download the PDF or feel free to contact us.
We provide equipment configurations tailored to our customers' needs based on unique ideas!
At the "KOKI TEC ASIA Exhibition Hall," you can verify soldering quality using reflow soldering, post-process soldering inspection, inline and tabletop selective soldering equipment. We offer operational training, soldering quality improvement, and maintenance (solder pot overhaul) training. Location: 5 minutes by car from BTS Udomsuk Station in Bangkok, located on Udomsuk Soi 31. 【Our Services】 ■ Manufacturing of automatic soldering equipment ■ After-sales service/training ■ Experiments (temperature profiles, soldering quality verification)/training (overhaul procedures, soldering teaching program creation procedures) *For more details, please download the PDF or feel free to contact us.
We will showcase a product that integrates inspection technology into soldering equipment, achieving process improvement!
Koki Tech Co., Ltd. will be exhibiting at "JISSO PROTEC 2026 (27th Assembly Process Technology Exhibition)" held at Tokyo Big Sight. We plan to showcase the "Soldering Equipment SELBO III," which integrates inspection technology into traditional soldering equipment, aiming to reduce soldering defects to an absolute minimum and achieve process improvement. At this exhibition, we will also display and demonstrate soldering equipment and inspection machines equipped with new methods. We sincerely look forward to your visit. 【Event Overview】 ■ Date: June 10 (Wed) - 12 (Fri), 2026, 10:00 AM - 5:00 PM ■ Venue: Tokyo Big Sight ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line, Kokusai-Tenjijo Station (about a 7-minute walk) - Yurikamome, Tokyo Big Sight Station (about a 3-minute walk) ■ Our Booth: East Hall 1, 1A-28 *For more details, please refer to the related links or feel free to contact us. *The main image is a photo of our exhibition booth from 2025.
Achieving high quality and high stability through patented technology.
The "Smart Dip L FXL-1" is a model compatible with L-sized circuit boards from the "Smart Dip Series," an automatic soldering device that achieves high quality and high stability. It generates waves through a stirring mechanism (our patented technology) to promote heat exchange and perform soldering. This maintains the advantages of reduced oxidation in the stationary tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Additionally, the solder tank is made of cast iron (FC300) to enhance durability. Due to the low flow velocity of the generated waves, this method minimizes copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard automatic setup changeover using QR codes ■ Reduction in daily maintenance time ■ Lower running costs due to minimal oxidation generation *For more details, please feel free to contact us.
Achieving low-cost carbon-neutral soldering!
The "S-WAVE Series" is a non-contact IH soldering device that employs a magnetic concentration and closed magnetic technology with an opening and closing mechanism. By inserting into the gap, it efficiently heats thick and thin pins, preheating the substrate with the leakage magnetic flux at the tip. After supplying solder, it heats the solder to stabilize the bonding. We deliver an automatic soldering device that realizes technology considerate of the environment, achieving speed, beauty, and low cost! 【Features】 ■ Adopts magnetic concentration and closed magnetic technology with an opening and closing mechanism ■ Capable of controlling power output at a speed of 100ms ■ Allows for optimal finishing of each point through heating adjustments ■ Achieves carbon-neutral soldering at a low cost ■ Reduces CO2 emissions during the soldering process *For more details, please refer to the PDF document or feel free to contact us.
The speed can be easily adjusted with the electric slider controller!
This is a notice from Renqiu Electric Machinery Manufacturing Co., Ltd. regarding the "TD-S102R model."
The quality of the product is guaranteed!
Anyone can easily perform soldering work, and newcomers can quickly transform into veteran workers.
Zero waste solder + CO2 reduction for environmental measures!
The IH soldering device 'S-WAVE' enables non-contact, pinpoint heating, allowing for soldering in narrow areas that cannot be addressed manually. There is no concern about the surrounding solder areas re-melting, making it possible to achieve high-quality and high-efficiency soldering even on high-density printed circuit boards. Since solder heating can be done non-contact, it achieves zero waste solder (free from solder residue on tips or in baths). This contributes to environmental issues by reducing CO2 emissions and lowering costs (a significant amount of CO2 is emitted during the recycling process of waste solder). <Features> ■ Energy-saving due to fewer consumables ■ Non-contact localized heating ■ Soldering possible from below ■ Low maintenance and low running costs ■ Rapid heating with high output even in hard-to-warm areas ■ High precision and fast soldering achievable *For more details, please refer to the PDF materials.
![IH Soldering Device S-WAVE [Improving Solder Quality and Increasing Production Volume]](https://image.mono.ipros.com/public/product/image/88b/2000750486/IPROS11888430495961627212.png?w=280&h=280)
"Non-contact soldering" meets high quality demands and mass production. A soldering device with non-contact and localized heating, currently under patent application. *Free sample processing available.
The IH soldering device "S-WAVE" enables non-contact and localized heating in confined spaces through heating technology. It eliminates the risk of re-melting surrounding solder areas, allowing for high-quality and efficient soldering of high-density printed circuit boards. It is suitable for production processes with high quality demands and is appropriate for mass production. *Compatible with terminals ranging from φ0.3 to 1.5mm. ～ Documents summarizing case studies and technical information are currently available! ～ You can view them immediately from the [PDF Download] link below. < Common Issues with Soldering > ◎ The running costs for adjusting or replacing consumable parts are burdensome... ◎ There are quality issues due to variability and burdens from rework processes... ◎ We want to improve yield... ◎ We want to solder in narrow areas that cannot be done manually... ◎ We want to switch from batch soldering to inline production... ◎ It is difficult to balance skill development and quality... ⇒ These concerns can be resolved with the "IH Soldering Device S-WAVE"! ★ If you would like to request sample processing or a demonstration with a demo machine, please feel free to contact us.
Ultra-compact design specialized for cell production!
The "Cell Soldier Series" is a super compact automatic soldering device that achieves excellent flow-up characteristics and maintainability at a low cost. Its compact design allows it to be implemented in small-scale workspaces at the office level. Despite being a small model, it can accommodate medium to large-sized PCBs (C250: width 250mm / C350: width 350mm). Additionally, the front cover open structure makes maintenance tasks easy to perform. It uses corrosion-resistant materials and employs cast iron for the tank material to reduce lead-free corrosion, while the PCB transport conveyor features resin claws to prevent solder adhesion. 【Features】 ■ Super compact ■ Easy maintenance ■ Uses corrosion-resistant materials *For more details, please refer to the catalog or feel free to contact us.
[Video now available]
Hiroki Tech: LMFS-400
![Ultrasonic Soldering Device Solder Touchable [Labor Reduction, Prevents Corrosion]](https://image.mono.ipros.com/public/product/image/874/2000184771/IPROS3139459417373430201.jpg?w=280&h=280)
Achieve astonishingly low prices! Soldering can be done on different materials such as glass and ceramics.
The Handatchable is a device that can solder materials such as glass and ceramics using ultrasonic waves. It is ideal for lead-out of solar cells, soldering aluminum wires, lead-out of superconductors and thermoelectric elements, and attaching electrodes to displays. <Features> - Compatible with various materials such as glass, ceramics, aluminum, and stainless steel - Eliminates the need for corrosive flux, allowing for a reduction in the number of processes and consideration for the environment - Achieves strength that is incomparable to conventional soldering As a pioneer in the manufacturing of ultrasonic soldering devices, our company offers a wide range of products. We cater to various needs, from handheld soldering irons to fully customized automated devices for mass production. For more details, please contact us or download the catalog.
Leave your welding and joining needs to us! Soldering equipment with customizable individual process conditions.
This product is an inline laser soldering device. It significantly shortens the cycle time by welding from the underside without the need for flipping. It enables laser soldering of DIP components directly connected to the SMT assembly line. Additionally, all major mechanical dimensions and auxiliary equipment (laser, solder wire feeder, dispenser, etc.) can be customized according to your requests and work size. 【Features】 ■ Enables laser soldering of DIP components directly connected to the SMT assembly line ■ Significantly shortens cycle time through welding from the underside without the need for flipping ■ Individual process conditions can be set ■ Supports local procurement overseas ■ All major mechanical dimensions and auxiliary equipment can be customized according to your requests and work size *For more details, please refer to the PDF document or feel free to contact us.
Low-cost inline partial soldering is possible! A device that can be configured with up to 8 stations.
"FUSION" is an inline production partial soldering device equipped with high-speed substrate transport, allowing for the selection of the number of stations and configurations according to the application. The standard 4-station setup accommodates substrates up to 381×460mm. With the optional substrate transport station, configurations of up to 8 stations are possible due to the inclusion of a return conveyor. For setups with 3 or more stations, it is more space-efficient than "SYNCHRODEX." Programs can be assigned to each station. A wide range of soldering nozzles, including micro nozzles, can be selected, and the use of an optional solder pot exchange trolley allows for easy replacement of the solder pot. 【Features】 ■ Low cost and space-saving ■ 3-axis control with DC servo mechanism with encoder ■ Maximum substrate size 746.5mm×460mm ■ Number of stations can be selected from 2 to 8 within the device *For more details, please refer to the catalog. Feel free to contact us with any inquiries. #Localized Soldering #Partial Soldering
